Single step solder process

Metal working – Method of mechanical manufacture – Electrical device making

Patent

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Details

2281801, 361400, H05K 334

Patent

active

047618817

ABSTRACT:
A technique is disclosed for attaching a variety of device types to the same side of a printed circuit board including a single solder application step for both surface mountable and leaded components, placement of the devices, drying of the solder and solder reflow.

REFERENCES:
patent: 3832769 (1974-09-01), Olyphant, Jr. et al.
patent: 4051550 (1977-09-01), Seno et al.
patent: 4139881 (1979-02-01), Shimizu et al.
patent: 4196839 (1980-04-01), Davis
patent: 4215025 (1980-07-01), Packer et al.
patent: 4373259 (1983-02-01), Motseh
patent: 4506443 (1985-03-01), Itoh
patent: 4515304 (1985-05-01), Berger
patent: 4642889 (1987-02-01), Grabbe
IBM Tech. Discl. Bulletin, vol. 24, No. 2, Jul. 1981, pp. 1214-1215 by L. V. Auletta et al.

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