Single semiconductor wafer transfer method and manufacturing sys

Details Single semiconductor wafer transfer method and manufacturing sys Single semiconductor wafer transfer method and manufacturing sys

1993-10-04

1994-12-13

Werner, Frank E.

Material or article handling

Apparatus for moving intersupporting articles into, within,...

Stack forming apparatus

414222, 414416, 414273, 414937, 414940, 414217, 414399, 414392, 180167, B65G 4700

Patent

active

053724712

ABSTRACT:
A manufacturing system and method for processing semiconductor wafers through a plurality of processing stations that perform manufacturing operations on wafers includes a plurality of processing stations, each of which are capable of performing at least one processing operation of a wafer, each of the processing stations having a controlled environment for processing the wafers, and a branched track providing a surface leading to each of said processing stations. On the track there are provided a plurality of guided transport vehicles adapted to travel between the process stations. A plurality of wafer carriers, each adapted to support a single wafer and be carried by the transport vehicles, are part of the system. An interface is provided at each processing station to introduce the wafer from the box into the clean environment of the process station, and subsequently return the box and wafer to the transport vehicle.

REFERENCES:
patent: 3845286 (1974-10-01), Aronstein et al.
patent: 4532970 (1985-08-01), Tullis et al.
patent: 4534389 (1985-08-01), Tullis
patent: 4540326 (1985-09-01), Southworth et al.
patent: 4764076 (1988-08-01), Laymon et al.
patent: 5024570 (1991-06-01), Kiriseko et al.

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