Single in-line package for surface mounting

Details Single in-line package for surface mounting Single in-line package for surface mounting

1993-03-05

1995-08-29

Jackson, Jerome

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

257666, 257676, 257730, 257787, 361813, H01L 2348, H01L 2944, H01L 2952, H05K 700

Patent

active

054463173

ABSTRACT:
A semiconductor package of a single in-line type including a semiconductor chip, a package body for accommodating the semiconductor chip and a plurality of leads held by the package body to extend substantially perpendicularly to a bottom edge surface of the package body. The package body carries a cutout part at a predetermined position of a side edge that surrounds the package body such that the cutout part is adapted for engagement with a support leg for supporting the package body substantially upright on a substrate.

REFERENCES:
patent: 4975763 (1990-12-01), Baudouin et al.

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