Single exposure process for preparing printed circuits

Radiation imagery chemistry: process – composition – or product th – Imaging affecting physical property of radiation sensitive... – Making electrical device

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29846, 29874, 156630, 156644, 156655, 1566591, 156902, 427 96, 427 98, 430313, B05D 512, H05K 300, B44C 122, C03C 1500

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044697775

ABSTRACT:
A process for preparing a two layer printed circuit having conductive interconnections wherein at least one layer of a photoadhesive composition is applied to a substrate bearing an electrically conductive circuit pattern and exposing said photoadhesive layer or layers through a circuit image of three different optical densities, i.e., zero, gray and opaque, removing portions of the photosensitive layer by solvent washout, applying finely divided metal, alloy or plating catalyst to adherent image areas, optionally curing the printed circuit, e.g., heating or ultraviolet exposure and plating to form an interconnected electrically conductive circuit pattern. Multilayer printed circuits can also be prepared by repeating the steps using additional layers of photoadhesive material.

REFERENCES:
patent: 3350498 (1967-10-01), Leeds
patent: 3436468 (1969-04-01), Haberecht
patent: 3965277 (1976-06-01), Guditz et al.
patent: 4413051 (1983-11-01), Thomas

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