Metal treatment – Barrier layer stock material – p-n type – With recess – void – dislocation – grain boundaries or channel...
Patent
1990-03-14
1992-06-23
Kunemund, Robert
Metal treatment
Barrier layer stock material, p-n type
With recess, void, dislocation, grain boundaries or channel...
148 333, 156603, 156604, 437 46, 437 62, 437 83, 437 84, 437174, 437233, 437973, H01L 21205, H01L 2184
Patent
active
051239752
ABSTRACT:
A single crystal silicon substrate which comprises an electric insulation member and a single crystal silicon film formed on the insulation member. The silicon film has first regions and second regions. Each of the first regions is formed as a strip shape and has a high density of inorganic impurities implanted thereinto. Each of the second regions is formed as a strip shape and has a low density of the impurities. The first and second regions are alternatively arranged contacting with each other so that the first regions are separated from each other.
REFERENCES:
patent: 3950188 (1976-04-01), Bower
patent: 4662059 (1987-05-01), Smeltzer
patent: 4743567 (1988-05-01), Pandya
patent: 4752590 (1988-06-01), Adams
Haga Koichi
Irinoda Mitsugu
Kunemund Robert
Ojan Ourmazd S.
Ricoh & Company, Ltd.
Ricoh Research Institute of General Electronics Co., Ltd.
LandOfFree
Single crystal silicon substrate does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Single crystal silicon substrate, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Single crystal silicon substrate will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-930634