Single bend actuator cupped paddle inkjet printing device

Details Single bend actuator cupped paddle inkjet printing device Single bend actuator cupped paddle inkjet printing device

1998-07-10

2001-11-06

Gulakowski, Randy (Department: 1746)

Etching a substrate: processes

Forming or treating thermal ink jet article

C347S054000, C347S055000, C347S062000

Reexamination Certificate

active

06312615

ABSTRACT:

STATEMENT REGARDING FEDERALLY SPONSORED RESEARCH OR DEVELOPMENT
Not applicable.
FIELD OF THE INVENTION
The field of the invention relates to the field of inkjet printing devices and in particular, discloses a method of manufacture of a single bend actuator cupped paddle inkjet printing device.
BACKGROUND OF THE INVENTION
Many ink jet printing mechanisms are known. Unfortunately, in mass production techniques, the production of ink jet heads is quite difficult. For example, often, the orifice or nozzle plate is constructed separately from the ink supply and ink ejection mechanism and bonded to the mechanism at a later stage (Hewlett-Packard Journal, Vol. 36 no 5, pp33-37 (1985)). These separate material processing steps required in handling such precision devices often add a substantial expense in manufacturing.
Additionally, side shooting ink jet technologies (U.S. Pat. No. 4,899,181) are often used but again, this limits the amount of mass production throughput given any particular capital investment.
Additionally, more esoteric techniques are also often utilised. These can include electroforming of nickel stage (Hewlett-Packard Journal, Vol. 36 no 5, pp33-37 (1985)), electro-discharge machining, laser ablation (U.S. Pat. No. 5,208,604), micro-punching, etc.
The utilisation of the above techniques is likely to add substantial expense to the mass production of ink jet print heads and therefore add substantially to their final cost.
It would therefore be desirable if an efficient system for the mass production of ink jet print heads could be developed.
When creating a large number of inkjet nozzles which together form a printhead, it is necessary or desirable to ensure that the printhead is of a compact form so as to ensure that the printhead takes up as small a space as possible. Further, it is desirable that any construction of a printhead is as simple as possible and preferably, the number of steps in construction are extremely low, therefore ensuring simplicity of manufacture. Further, preferably each ink ejection nozzle is of a standard size and the ink forces associates with the ejection are regular across the nozzle.
Further, where the ink ejection mechanism is of a mechanical type attached to an actuator device, it is important to ensure that a substantial clearance is provided between an ink ejection nozzle and the surface of the paddle. Unless a large clearance is provided (of the order of 10 &mgr;m in the case of a 40 &mgr;m nozzle) a number of consequential problems may arise. For example, if a mechanical paddle ejection surface and nozzle chamber walls are too close, insufficient ink will be acted on by the paddle actuator so as to form a drop to be ejected. Further, high pressures and drag is likely to occur where movement of a paddle occurs close to nozzle chamber walls. Further, if the paddle is too close to the nozzle, there is a danger that an unwanted meniscus shape may occur after ejection of an ink drop with the ink meniscus surface attaching to the surface of the paddle.
Further, should the ink ejection mechanism be formed on a silicon wafer type device utilising standard wafer processing techniques, it is desirable to minimise the thickness of any layer of material when forming the system. Due to differential thermal expansions, it is desirable to ensure each layer is of minimal thickness so as to reduce the likelihood of faults occurring during the fabrication of a printhead system due to thermal stress. Hence, it is desirable to construct a printhead system utilising thin layers in the construction process.
SUMMARY OF THE INVENTION
It is an object of the present invention to provide for an improved form of manufacture of an ink jet printing system.
In accordance with a first aspect of the present invention, there is provided a method of manufacturing a single bend actuator cupped paddle ink jet print nozzle wherein an array of nozzles are formed on a substrate utilising planar monolithic deposition, lithographic and etching processes.
Multiple ink jet heads are preferably formed simultaneously on a single planar substrate which can comprise a silicon wafer.
The print heads are preferably formed utilising standard vlsi/ulsi processing. Integrated drive electronics are preferably formed on the same substrate. The integrated drive electronics may be formed by a CMOS fabrication process.
Ink can be ejected from the substrate substantially normal to the substrate.
In accordance with a further aspect of the present invention, there is provided a method of manufacture of an ink jet printing nozzle arrangement on a wafer, the arrangement including: an ink chamber having an ink ejection nozzle in one wall thereof for the ejection of ink from the ink chamber; a moveable paddle vane located within the ink chamber, the paddle vane including a concave surface in the area adjacent the ink ejection nozzle; and an actuator means adapted to move the paddle vane so as to cause ink within the ink chamber to be ejected from the ink ejection nozzle; the method comprising the steps of: forming an etched pit in the wafer; depositing and etching a series of layers on a wafer so as to form an array of ink jet nozzle arrangements, the layers including at least one paddle vane formation layer, the paddle vane formation layer being deposited over portions of the etched pit resulting in the formation of the concave surface of the paddle vane.
The paddle vane formation layer can be deposited on a sacrificial layer deposited before the paddle vane formation layer, the sacrificial layer forming a concave surface profile as a result of deposition over the etched pit. The maximum thickness of any one of the deposited layers can be 6 microns.
The series of layers are preferably each of a low thickness outside of the etched pit so as to cause minimal thermal stress on the wafer layer.
The actuator means can be initially constructed on a sacrificial layer which can be subsequently etched away, such that when the sacrificial layer is etched away, the paddle vane can be moved by the actuator means from a constrained position having the paddle vane close to the ink ejection nozzle to a quiescent position having the paddle vane positioned further away from the ink ejection nozzle.
The steps are preferably also utilized to simultaneously separate the wafer into separate printheads.
Further, preferably, the paddle vane includes a slit in a surface thereof to assist in the refill flow of ink into the ink chamber.


REFERENCES:
patent: 3747120 (1973-07-01), Stemme
patent: 4987526 (1991-01-01), Slocum et al.

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