Simplified method for repair of high density interconnect circui

Details Simplified method for repair of high density interconnect circui Simplified method for repair of high density interconnect circui

1988-12-12

1989-11-07

Powell, William A.

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

156634, 156637, 156652, 156655, 156656, 156666, 156668, 156247, 156344, C23F 102, B44C 122, C03C 1500, B29C 3700

Patent

active

048789917

ABSTRACT:
A simplified method of gaining access to, for the purpose of replacing, a defective integrated circuit chip situated in a high density interconnect (HDI) circuit (10) comprises heating the HDI circuit to a temperature at which the peel strength of an adhesive (16) bonding a polymer overlay layer (18) to the tops of integrated circuit chips (4, 6, and 8) positioned on a substrate (12) is reduced. The polymer overlay layer, which may comprise one or multiple layers, is then peeled from the chips. The adhesive is present in sufficient quantity to protect the chips. The adhesive is then dissolved by subjecting the substrate to different solvents of successively lower solubility for the adhesive. Metal divots (34) left on chip pads (36) are removed by selectively etching copper in the presence of ultrasonic agitation. The entire circuit is finally subjected to a high pressure spray to remove any particulate remaining on the chips, so that the defective chip may be readily replaced without damaging or contaminating the HDI circuit.

REFERENCES:
patent: 4714516 (1987-12-01), Eichelberger et al.
patent: 4780177 (1988-10-01), Wojnarowski et al.
patent: 4783695 (1988-11-01), Eichelberger et al.
H. S. Cole et al., Laser Processing for Interconnect Technology, SPIE, vol. 877, Micro-Optoelectronic Materials (1988), pp. 92-96.
C. W. Eichelberger et al., High-Density Interconnects for Electronic Packaging, SPIE, vol. 877, Micro-Optoelectronic Materials (1988), pp. 90-91.

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