Simplified etching technique for producing multiple undercut...

Details Simplified etching technique for producing multiple undercut... Simplified etching technique for producing multiple undercut...

2006-05-30

2006-05-30

Alanko, Anita (Department: 1765)

Etching a substrate: processes

Etching of semiconductor material to produce an article...

C216S011000, C216S017000, C216S041000, C216S046000, C216S057000, C216S067000, C216S072000, C216S083000, C430S316000, C438S696000, C438S704000, C438S733000, C438S739000, C438S750000, C438S756000

Reexamination Certificate

active

07052617

ABSTRACT:
A process for producing multiple undercut profiles in a single material. A resist pattern is applied over a work piece and a wet etch is performed to produce an undercut in the material. This first wet etch is followed by a polymerizing dry etch that produces a polymer film in the undercut created by the first wet etch. The polymer film prevents further etching of the undercut portion during a second wet etch. Thus, an undercut profile can be obtained having a larger undercut in an underlying portion of the work piece, utilizing only a single resist application step. The work piece may be a multi-layer work piece having different layers formed of the same material, or it may be a single layer of material.

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