Semiconductor device manufacturing: process – Masking
Reexamination Certificate
2005-05-17
2005-05-17
Niebling, John F. (Department: 2812)
Semiconductor device manufacturing: process
Masking
C438S401000, C438S462000, C438S552000, C438S942000
Reexamination Certificate
active
06893987
ABSTRACT:
An alignment pattern is required for photo masks to be exactly aligned with one another; an amorphous silicon is deposited over the entire surface of an insulating layer except for an area where the alignment pattern is to be formed, and a pattern for an ion-implantation and the alignment pattern are concurrently transferred to a photo resist layer; dopant impurity is ion implanted into the amorphous silicon layer by using the photo resist mask, and the insulating layer is selectively etched also by using the photo resist mask; this results in simplification of the process sequence.
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Okumura Fujio
Shiota Kunihiro
Hayes & Soloway P.C.
Isaac Stanetta
NEC Corporation
Niebling John F.
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