Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
Reexamination Certificate
2011-03-29
2011-03-29
Zarneke, David A (Department: 2891)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
With contact or lead
C257SE23153
Reexamination Certificate
active
07915725
ABSTRACT:
Disclosed is a semiconductor silicon wafer having an electric power supply affixed to the backside of the wafer. By fabricating the electric power supply onto the backside of the wafer that has been left unused, the semiconductor chip can have a self-supplied power, realizing the self-powered semiconductor chip with an increased efficiency. Further, since the electric power supply is installed on the wafer, not the semiconductor chip, the fabrication procedure becomes very simple, and the battery can be mounted on any type of chip.
REFERENCES:
patent: 4855613 (1989-08-01), Yamada et al.
patent: 5874782 (1999-02-01), Palagonia
patent: 1134808 (2001-09-01), None
patent: 101998003968 (1998-08-01), None
Ahn Hyo-Jun
Ahn Jou-Hyeon
Cho Gyu-Bong
Cho Kwon-Koo
Choi Hyun-Chil
Birch & Stewart Kolasch & Birch, LLP
Industry-Academic Cooperation Foundation Gyeongsang National Uni
Zarneke David A
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