Semiconductor device manufacturing: process – Semiconductor substrate dicing
Reexamination Certificate
2005-01-25
2005-01-25
Ghyka, Alexander (Department: 2812)
Semiconductor device manufacturing: process
Semiconductor substrate dicing
C438S745000, C438S753000
Reexamination Certificate
active
06846726
ABSTRACT:
Silicon parts of a semiconductor processing apparatus containing low levels of metal impurities that are highly mobile in silicon are provided. The silicon parts include, for example, rings, electrodes and electrode assemblies. The silicon parts can reduce metal contamination of wafers processed in plasma atmospheres.
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Hubacek Jerome S.
Ren Daxing
Webb Nicholas E.
Ghyka Alexander
Lam Research Corporation
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