Silicon microstructures and process for their fabrication

Details Silicon microstructures and process for their fabrication Silicon microstructures and process for their fabrication

1996-11-15

1998-01-20

Breneman, R. Bruce

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

1566571, 216 2, 216 11, H01L 2100, B44C 122

Patent

active

057097739

ABSTRACT:
A flexible and efficient bulk micromachining method for fabricating a novel microstructure that is bounded by substantially planar surfaces meeting only at substantially right angle corner features. The novel microstructure of the present invention is useful as a spacer in assembly processes where high accuracy is required, such as precise positioning of optical fibers or conductors. In the preferred embodiment, the microstructure of the present invention includes a shelf feature disposed along a height dimension of the microstructure, which is required for some applications.
The bulk micromachining method of the present invention includes providing a first substrate having a top planar surface and an opposing planar surface. The opposing surface of the substrate is anisotropically etched to provide a first thinned region. The top surface of the first substrate is anisotropically etched so that a first recessed feature having a vertical side is made integral with the first thinned region. Similarly, a second substrate having a top planar surface and an opposing planar surface is provided. The opposing surface of the second substrate is anisotropically etched to provide a second thinned region. The top surface of the second substrate is anisotropically etched so that a second recessed feature having a vertical side wall is made integral with the second thinned region. The top surface of the first substrate is aligned and coupled with the top surface of the second substrate to produce the desired microstructure. The substrates are cut or sawn to free the microstructure.

REFERENCES:
patent: 4470875 (1984-09-01), Poteat
patent: 5501784 (1996-03-01), Lessmollmann et al.
patent: 5589083 (1996-12-01), Ahn et al.

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