Silicon-glass bonded wafers

Details Silicon-glass bonded wafers Silicon-glass bonded wafers

1997-06-30

1999-11-30

Whitehead, Jr., Carl

Semiconductor device manufacturing: process

Bonding of plural semiconductor substrates

438459, H01L 2160

Patent

active

059942045

ABSTRACT:
Semiconductor-on-glass integrated circuits may include photodetectors which are stimulated by backside light passing through the glass substrate; this provides information reception by optical communication. Bipolar and field effect transistors are shielded from the light by their buried layers. Further, LEDs integrated together with photodetectors permits all optical communication among glass substrate chips. Alternative uses of glass substrate include thermal isolation for efficient thermally regulated integrated circuits.

REFERENCES:
patent: 5750000 (1998-05-01), Yonehara et al.
patent: 5755914 (1998-05-01), Yonehara

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