Silicon etching process using polymeric mask, for example, to fo

Details Silicon etching process using polymeric mask, for example, to fo Silicon etching process using polymeric mask, for example, to fo

1992-02-03

1993-06-08

Powell, William A.

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

156633, 156643, 156647, 156656, 156657, 156662, 156668, 156904, H01L 21306, B44C 122, B29C 3700

Patent

active

052175685

ABSTRACT:
A process for etching a silicon substrate to form a feature such as a V-groove, utilizes a coating formed of an alkaline resistance polymer. A preferred polymer is poly(benzocyclobutene) resin. The coating is applied to the substrate and removed form a selected region whereupon the underlying silicon is etched with an alkaline solution. In one aspect, an optical fiber is inserted in the etched groove and coupled to an optical waveguide embedded within the coating.

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patent: 5046809 (1991-09-01), Stein
Burdeaux et al., "Benzocyclobutene (BCD) Dielectrics for the Fabrication of High Density, Thin Film Multi-Chip Modules", vol. 19, No. 20 (1990), pp. 1357-1366.
Sanseau et al., "Improved Lift-Off Pillar Fabrication Technique Using a IP200 Polyphenylquinoxaline Polymer", Polymeric Materials for Electronic Packaging and High Technology Applications, vol. 88-17, (The Electrochemical Society, Inc,.).
Koklubun, et al., "Silicon Optical Printed Circuit Board for Three-Dimensional Integrated Optics", Electronics Letters, vol. 21, No. 11, (1985), pp. 508-509.
Reche et al. "High Density Multi-Chip Module Fabrication", The International Journal for Hybrid Microelectronics, vol. 13, No. 4 pp. 91-99.

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