Silicon device with uniformly thick polysilicon

Details Silicon device with uniformly thick polysilicon Silicon device with uniformly thick polysilicon

1979-05-02

1980-10-14

Edlow, Martin H.

Coating processes

Electrical product produced

Integrated circuit, printed circuit, or circuit board

357 23, 357 4, 427 85, 427 86, 427 93, 427 9, H01L 2904

Patent

active

042284520

ABSTRACT:
Thickness control problems inherent in the chemical vapor deposition of polysilicon layers on silicon wafers are avoided by an improved vacuum deposition technique.

REFERENCES:
patent: 4109273 (1978-08-01), Glasl et al.
patent: 4151006 (1979-04-01), De Graaf et al.
Brodsky et al., I.B.M. Tech. Discl. Bull, vol. 19, No. 3, Aug. 1976, p. 1119.

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