Silicon containing resists

Adhesive bonding and miscellaneous chemical manufacture – Delaminating processes adapted for specified product – Delaminating in preparation for post processing recycling step

Patent

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Details

156646, 1566591, 156668, 156904, 427 431, 428447, 430296, 430270, 430313, B44C 122, B29C 3700, C03C 1500, C03C 2506

Patent

active

047642475

ABSTRACT:
The fabrication of improved semiconductor devices having photoresist materials in the form of silicon containing polystyrene copolymers of a halomethylstyrene and an alkylsilylstyrene and the resulting improved semiconductor wafer device containing silicon prior to etching; the resulting resist having reduced resist erosion and improved plasma resiliency.

REFERENCES:
patent: 4551418 (1985-11-01), Hult et al.
patent: 4657843 (1987-04-01), Fukuyama et al.

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