Adhesive bonding and miscellaneous chemical manufacture – Delaminating processes adapted for specified product – Delaminating in preparation for post processing recycling step
Patent
1987-03-18
1988-08-16
Powell, William A.
Adhesive bonding and miscellaneous chemical manufacture
Delaminating processes adapted for specified product
Delaminating in preparation for post processing recycling step
156646, 1566591, 156668, 156904, 427 431, 428447, 430296, 430270, 430313, B44C 122, B29C 3700, C03C 1500, C03C 2506
Patent
active
047642475
ABSTRACT:
The fabrication of improved semiconductor devices having photoresist materials in the form of silicon containing polystyrene copolymers of a halomethylstyrene and an alkylsilylstyrene and the resulting improved semiconductor wafer device containing silicon prior to etching; the resulting resist having reduced resist erosion and improved plasma resiliency.
REFERENCES:
patent: 4551418 (1985-11-01), Hult et al.
patent: 4657843 (1987-04-01), Fukuyama et al.
Leveriza Carina T.
Morgan Russell A.
Pacini Harry A.
Powell William A.
Syn Labs, Inc.
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