Semiconductor device manufacturing: process – Forming schottky junction – Using platinum group metal
Reexamination Certificate
2007-02-06
2007-02-06
Coleman, W. David (Department: 2823)
Semiconductor device manufacturing: process
Forming schottky junction
Using platinum group metal
C257SE29160
Reexamination Certificate
active
11287405
ABSTRACT:
A semiconductor device comprises an n-type MIS transistor comprising a first gate insulating film and a first gate electrode including an MSixfilm formed on the first gate insulating film, where M represents a metal element selected from tungsten and molybdenum and x is greater than 1, i.e., x>1; and a p-type MIS transistor comprising a second gate insulating film and a second gate electrode including an MSiyfilm formed on the second gate insulating film, where y is not less than 0 and less than 1, i.e., 0≦y<1.
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Matsuo Kouji
Nakajima Kazuaki
Coleman W. David
Finnegan Henderson Farabow Garrett & Dunner L.L.P.
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