Silicon chip metallization system

Details Silicon chip metallization system Silicon chip metallization system

1990-04-05

1991-07-02

Heinrich, Sam

Metal fusion bonding

Process

Metal to nonmetal with separate metallic filler

228124, 437190, 357 71, H01L 2158, B23K10140

Patent

active

050279971

ABSTRACT:
An improved silicon chip metallization system for use in attaching silicon chips to substrates. The improvement comprises providing a layer of titanium between the silicon chip backside and the layers of chrome and gold which are conventionally used as the backside metallization. The layer of titanium adjacent to the silicon chip backside reduces silicon dioxide formation during chip attachment procedures carried out in non-vacuum environments.

REFERENCES:
patent: 3651562 (1972-03-01), Hambleton
patent: 4023725 (1977-05-01), Ivett et al.
patent: 4513905 (1985-04-01), Nowicki et al.
patent: 4772935 (1988-09-01), Lawler et al.
patent: 4884123 (1989-11-01), Dixit et al.

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