4. Metal fusion bonding
  5. Process
  6. Metal to nonmetal with separate metallic filler

Stuart C. Billette

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Ferroelectric capacitor circuit for sensing hydrogen gas

Active solid-state devices (e.g. – transistors – solid-state diode – Field effect device – Having insulated electrode
Reexamination Certificate

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Silicon chip metallization system

Metal fusion bonding – Process – Metal to nonmetal with separate metallic filler
Patent

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Profile ID: LFUS-PAI-P-1335638

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