Silicon carbide components of semiconductor substrate...

Details Silicon carbide components of semiconductor substrate... Silicon carbide components of semiconductor substrate...

2007-09-11

2007-09-11

Deo, Duy-Vu N (Department: 1765)

Adhesive bonding and miscellaneous chemical manufacture

Differential fluid etching apparatus

C156S345510

Reexamination Certificate

active

10706938

ABSTRACT:
Silicon carbide components of a plasma processing apparatus, methods of making the components, and methods of using the components during processing of semiconductor substrates to provide for reduced particle contamination of the substrates are provided. The silicon carbide components are made by a process that results in free-carbon in the components. The silicon carbide components are treated to remove the free-carbon from at least the surface.

REFERENCES:
patent: 4529474 (1985-07-01), Fujiyama et al.
patent: 5820723 (1998-10-01), Benjamin et al.
patent: 6073577 (2000-06-01), Lilleland et al.
patent: 6129808 (2000-10-01), Wicker et al.
patent: 6136211 (2000-10-01), Qian et al.
patent: 6379575 (2002-04-01), Yin et al.
patent: 6391787 (2002-05-01), Dhindsa et al.
patent: 6464843 (2002-10-01), Wicker et al.
patent: 6659111 (2003-12-01), Mouri et al.
patent: 6767836 (2004-07-01), San et al.
patent: 6776581 (2004-08-01), Ishikawa
patent: 6872322 (2005-03-01), Chow et al.
patent: 6899785 (2005-05-01), Dutra et al.
patent: 2002/0123230 (2002-09-01), Hubacek
Commonly owned U.S. Appl. No. 09/607,922, filed Jun. 30, 2000.
International Preliminary Report on Patentability for PCT/US2004/037945 dated May 15, 2006.

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