Silicon building blocks in integrated circuit packaging

Details Silicon building blocks in integrated circuit packaging Silicon building blocks in integrated circuit packaging

2007-04-17

2007-04-17

Ho, Tu-Tu (Department: 2818)

Active solid-state devices (e.g., transistors, solid-state diode

Physical configuration of semiconductor

With electrical contact in hole in semiconductor

C257S690000, C257S698000, C257SE23011

Reexamination Certificate

active

10931497

ABSTRACT:
An improved silicon building block is disclosed. In an embodiment, the silicon building block has at least two vias through it. The silicon building block is doped and the vias filled with a first material, and, optionally, selected ones of the vias filled instead with a second material. In an alternative embodiment, regions of the silicon building block have metal deposited on them.

REFERENCES:
patent: 3646666 (1972-03-01), Boleky et al.
patent: 4534100 (1985-08-01), Lane
patent: 4969022 (1990-11-01), Nishimoto et al.
patent: 5084403 (1992-01-01), Matsuoka
patent: 6221769 (2001-04-01), Dhong et al.
patent: 6268238 (2001-07-01), Davidson et al.
patent: 6603915 (2003-08-01), Glebov et al.
patent: 6608250 (2003-08-01), Ghoshal
patent: 6674138 (2004-01-01), Halliyal et al.
patent: 2002/0022362 (2002-02-01), Ahn et al.
patent: 2002/0155386 (2002-10-01), Xu et al.
patent: 2003/0003665 (2003-01-01), Nakagawa
patent: 2003/0057517 (2003-03-01), Goldberger et al.
patent: 2003/0104688 (2003-06-01), Wade
patent: 2004/0108587 (2004-06-01), Chudzik et al.

Affiliated with

Also associated with

Rating

Silicon building blocks in integrated circuit packaging does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Silicon building blocks in integrated circuit packaging, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Silicon building blocks in integrated circuit packaging will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3737155