Silica microspheres, method for making and assembling same...

Coating processes – Direct application of electrical – magnetic – wave – or... – Plasma

Reexamination Certificate

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C427S212000, C427S576000, C427S578000, C065S021100, C065S021300, C065S021400, C065S060100, C065S060500

Reexamination Certificate

active

07927670

ABSTRACT:
The invention concerns silica microspheres (M) having an outer diameter between 50 and 125 μm, preferably between 60 and 90 μm, a wall thickness not less than 1 μm, preferably between 1 and 3 μm and a density between 0.3 and 0.7/cm3, a manufacturing method by injecting silica microsphere precursors (MS, PR1, PR1′, PR2′) into an inductive plasma (P), assembly methods and possible uses of silica microspheres.

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“Behavior of Silica Particles of Different Microstructure on RF Thermal Plasma Treatment,” Karoly et al., Journal of Materials Science Letters, Chapman and Hall Ltd., vol. 21, No. 24, Dec. 15, 2002, pp. 1943-1945, XP001166772.
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