Signal line structure for a TFT-LCD and method for fabricating t

Etching a substrate: processes – Forming or treating article containing a liquid crystal...

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216 41, 216 75, 216100, C30B 3300

Patent

active

054678820

ABSTRACT:
A signal line structure for TFT-LCD and a method for fabricating the same are disclosed. The method comprises the steps of: forming a first metal and a second metal, in due order, on a glass substrate; defining the width (W.sub.1) of the second metal and subsequently, applying an etching process to the second metal; and depositing a third metal entirely on the resulting structure and defining the width (W.sub.2) of signal line so as to simultaneously remove the unnecessary portions of the first metal and said third metal. The signal line structure fabricated by the method is structured to comprise an insulating substrate; a first metal formed on the insulating substrate, having a good adhesiveness to said insulating substrate; a second metal formed on the first metal, having a low resistance; a third metal comprised of the same material that the first metal is, the third metal together with the first metal surrounding the second metal to prevent the oxidation of said second metal. A disconnection in the signal line is prevented by twice etching processes. The leakage and the shortage between the source/drain electrode and the gate electrode are prevented in the TFT-LCD structure. The method provides a pad to which COG can be applied, and brings about such an effect that the production yield is improved.

REFERENCES:
patent: 5091337 (1992-02-01), Watanabe

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