Sidewall spacer using an overhang

Adhesive bonding and miscellaneous chemical manufacture – Delaminating processes adapted for specified product – Delaminating in preparation for post processing recycling step

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Details

1566571, 15665911, 216 46, 437228, 437 67, H01L 213105

Patent

active

056518579

ABSTRACT:
Improved film spacers for the sidewalls within semiconductor structures are disclosed. The spacers are made of non-conformal, organic materials, such as polyimides, acrylates, methacrylates, and various photoresist compositions. They are formed on the sidewalls by a process which involves the formation of overhang structures. The film spacers may be used for a variety of applications, such as sidewall imaging, control of dopant diffusion in an FET, formation of borderless contacts, and the manufacture of a resistor from an FET.

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"Micromachine Transfer Belt", Cronin et al., IBM Technical Disclosure Bulletin, 34, No. 4B, 330-331 (Sep. 1991).

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