SiC semiconductor device having bottom layer and method for...

Active solid-state devices (e.g. – transistors – solid-state diode – Field effect device – Having insulated electrode

Reexamination Certificate

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Details

C257S332000, C257S342000, C257SE29262, C257SE21410, C257SE29169, C438S270000, C438S272000, C438S286000

Reexamination Certificate

active

07851854

ABSTRACT:
A SiC semiconductor device includes: a substrate; a drift layer on the substrate; a trench on the drift layer; a base region in the drift layer sandwiching the trench; a channel between the base region and the trench; a source region in the base region sandwiching the trench via the channel; a gate electrode in the trench via a gate insulation film; a source electrode coupled with the source region; a drain electrode on the substrate opposite to the drift layer; and a bottom layer under the trench. An edge portion of the bottom layer under a corner of a bottom of the trench is deeper than a center portion of the bottom layer under a center portion of the bottom of the trench.

REFERENCES:
patent: 2009/0032821 (2009-02-01), Onose et al.
patent: 2009/0072241 (2009-03-01), Harris et al.
patent: A-2001-267570 (2001-09-01), None

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