Semiconductor device manufacturing: process – Formation of semiconductive active region on any substrate – Polycrystalline semiconductor
Patent
1997-06-20
1999-08-10
Chaudhari, Chandra
Semiconductor device manufacturing: process
Formation of semiconductive active region on any substrate
Polycrystalline semiconductor
438931, 117 88, 117 89, C30B 2300
Patent
active
059373164
ABSTRACT:
The present invention is a SiC member and fabrication method thereof useful for heat treating semiconductors, wherein at least the surface of the member comprises: CVD-.beta.-phase SiC columnar crystals grown in perpendicular to the surface of the member; and CVD-.alpha.-phase SiC crystals grown up from interface of CVD-.beta.-phase columnar crystals. This structure thereby makes it possible to reduce the infrared ray transmittance of the heat treatment member and facilitates the heating of the heat treatment member by absorbing the infrared rays. Absorption of the IR rays results in favorable the temperature follow-up characteristics during the heat treatment of a semiconductor.
REFERENCES:
patent: 3956032 (1976-05-01), Powell et al.
patent: 5037502 (1991-08-01), Suzuki et al.
patent: 5604151 (1997-02-01), Goela et al.
patent: 5614447 (1997-03-01), Yamaga et al.
Inaba Takeshi
Sato Masanori
Takeda Syuichi
Chaudhari Chandra
Christianson Keith
Toshiba Ceramics Co. Ltd.
LandOfFree
SiC member and a method of fabricating the same does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with SiC member and a method of fabricating the same, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and SiC member and a method of fabricating the same will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-1130291