Si containing high molecular compound and photosensitive resin c

Details Si containing high molecular compound and photosensitive resin c Si containing high molecular compound and photosensitive resin c

1996-05-31

1998-03-03

Chu, John S.

Radiation imagery chemistry: process, composition, or product th

Imaging affecting physical property of radiation sensitive...

Radiation sensitive composition or product or process of making

4302721, 528 10, 528 31, 528 32, G03F 7039

Patent

active

057232571

ABSTRACT:
An Si containing high molecular compound is acquired by crosslinking acid obtained by polysilsesquioxane having a vinyl group in a side chain and alkoxysilane. This Si containing high molecular compound is expressed by a general formula given below ##STR1## where R.sup.1 represents a C.sub.2 -C.sub.8 divalent saturated hydrocarbon group, R.sup.2 represents a C.sub.1 -C.sub.8 hydrocarbon group, R.sup.3 represents a C.sub.1 -C.sub.8 hydrocarbon group, Z represents a hydrocarbon atom or trimethylsilyl group, a is 1 to 3, b is 0 to 2 with a sum of a and b being 3, and n is a positive integer selected from 10 to 500. A photosensitive resin composition is obtained by combining the Si containing high molecular compound with a photoacid generator.

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