Shutter

Chemistry: electrical and wave energy – Apparatus – Coating – forming or etching by sputtering

Reexamination Certificate

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Details

C118S720000, C118S504000

Reexamination Certificate

active

06929724

ABSTRACT:
This invention relates to a shutter for use in physical vapour deposition apparatus having a chamber. The shutter, generally indicated at5, is located in a side housing6of the vacuum chamber7, whilst sputtering is taking place. Once the substrate2is treated, the substrate is removed from the chamber and the shutter is brought in to an operative position above a wafer pedestal or support1.The shutter is mounted on an arm8using a fixing boss10, the arm and the boss being magnetically coupled.

REFERENCES:
patent: 4702506 (1987-10-01), Iimura
patent: 5413688 (1995-05-01), Crowley
patent: 1480564 (1975-09-01), None
patent: 2 060 761 (1981-05-01), None
patent: 2 075 109 (1981-11-01), None
patent: 59-139616 (1984-08-01), None
patent: 61-248544 (1986-11-01), None
patent: 63-161166 (1988-07-01), None
patent: 2-38562 (1990-02-01), None
patent: 4-99865 (1992-03-01), None
patent: 4-193948 (1992-07-01), None
patent: 5-70947 (1993-03-01), None
patent: 6-172992 (1994-06-01), None
patent: 63-213668 (1998-09-01), None
patent: 2001-131739 (2001-05-01), None
patent: 2002-118063 (2002-04-01), None

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