Shielded trace structure and fabrication method

Details Shielded trace structure and fabrication method Shielded trace structure and fabrication method

2008-01-23

2010-11-16

Banks, Derris H (Department: 3729)

Metal working

Method of mechanical manufacture

Electrical device making

C029S882000, C029S846000, C029S842000, C029S829000

Reexamination Certificate

active

07832097

ABSTRACT:
A method includes forming a patterned sacrificial layer on a first carrier and a patterned trace layer on the patterned sacrificial layer. The patterned sacrificial layer and the patterned trace layer are laminated to a dielectric material. The first carrier and the patterned sacrificial layer are removed creating sacrificial layer gaps above the patterned trace layer. The sacrificial layer gaps are filled with a trace layer isolation dielectric material. Shield trenches are laser-ablated within the dielectric material and on opposite sides of a signal trace of the patterned trace layer. The shield trenches are filled with an electrically conductive material to form shield walls. The electrically conductive material is patterned to form a shield top. The shield top, the shield walls, and a second carrier form a bias shield around the signal trace.

REFERENCES:
patent: 6035527 (2000-03-01), Tamm
patent: 6187660 (2001-02-01), Gardner
patent: 6194250 (2001-02-01), Melton et al.
patent: 6730857 (2004-05-01), Konrad et al.
patent: 6740964 (2004-05-01), Sasaki
patent: 6919514 (2005-07-01), Konrad et al.
patent: 7242081 (2007-07-01), Lee
patent: 7345361 (2008-03-01), Mallik et al.
patent: 7372151 (2008-05-01), Fan et al.
patent: 2006/0124345 (2006-06-01), Asami et al.
patent: 2007/0273049 (2007-11-01), Khan et al.
patent: 2007/0290376 (2007-12-01), Zhao et al.
patent: 2008/0230887 (2008-09-01), Sun et al.
Scanlan, “Package-on-package (PoP) with Through-mold Vias”,Advanced Packaging, Jan. 2008, 3 pages, vol. 17, Issue 1, PennWell Corporation.
Kim et al., “Application of Through Mold Via (TMV) as PoP base package”,58thECTC Proceedings, May 2008, Lake Buena Vista, FL, 6 pages, IEEE.
Huemoeller et al., U.S. Appl. No. 11/543,540, filed Oct. 4, 2006, entitled “Method and Structure for Creating Embedded Metal Features”.
Berry et al., “Thin Stacked Interposer Package”, U.S. Appl. No. 11/865,617, filed Oct. 1, 2007.
Scanlan, “Package-on-package (PoP) with Through-mold Vias”,Advanced Packaging, Jan. 2008, 3 pages, vol. 17, Issue 1, PennWell Corporation.
Kim et al., “Application of Through Mold Via (TMV) as PoP base package”,58thECTC Proceedings, May 2008, Lake Buena Vista, FL, 6 pages, IEEE.

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