Shielded semiconductor device package

Details Shielded semiconductor device package Shielded semiconductor device package

1991-02-04

1996-09-17

Hille, Rolf

Active solid-state devices (e.g., transistors, solid-state diode

With shielding

257687, 257704, 257787, 361816, 361820, 174 522, H01L 23552, H01L 2302

Patent

active

055571425

ABSTRACT:
A shielded semiconductor package and a method for manufacturing the package is provided. The shielded semiconductor package comprises a metal coating (19) applied over an encapsulated semiconductor device (16). The device may be transfer molded or encapsulated by glob top technology. The metal coating (19) serves as a barrier to the transmission of electromagnetic or radio frequency energy, thereby shielding the semiconductor device (16). The shielded semiconductor package is manufactured by providing a metallization pattern (12 and 14) on a substrate (10) and mechanically attaching and electrically interconnecting a semiconductor device (16) to the metallization pattern. A resin (18) is transfer molded about the semiconductor device, the electrical interconnections (17), and the metallization pattern so as to form an assembly, and a metal coating (19) is applied via vacuum deposition or plating to interconnect with a portion of the metallization pattern.

REFERENCES:
patent: 3614546 (1971-10-01), Avins
patent: 3816911 (1974-06-01), Knappenberger
patent: 4370515 (1983-01-01), Donaldson
patent: 4567317 (1986-01-01), Ehrlich et al.
patent: 4641224 (1987-02-01), Reimer

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