Shielded EPROM package

Details Shielded EPROM package Shielded EPROM package

1993-05-03

1994-10-11

Hille, Rolf

Active solid-state devices (e.g., transistors, solid-state diode

With shielding

257680, 257787, H01L 2504, H01L 2328

Patent

active

053550161

ABSTRACT:
A shielded, erasable-programmable-read-only-memory (EPROM) package is provided. A circuit carrying substrate (10), contains an area for mounting an EPROM chip (16), having conductive interconnecting patterns (12) adjacent to the chip mounting area. The EPROM chip is mounted on the circuit carrying substrate, and the pad electrodes on the EPROM chip are connected to pads on the conductive patterns of the substrate by wire bonds (17) or other means. An ultraviolet (UV) light transmitting resin (18) is transfer molded onto the circuit carrying substrate, covering the EPROM chip (16) and the wire bonds (17) so as to provide an optical path through the material to the top surface of the EPROM chip, and sealing the EPROM chip from the exterior of the package. An adherent metal coating (19) is sputtered over the transfer molded resin, and the metal coating is coated with a protective organic resin (15). Both the metal coating and the organic resin are at least partially transparent to ultraviolet light.

REFERENCES:
patent: 3614546 (1971-10-01), Avins
patent: 4107555 (1978-08-01), Haas et al.
patent: 4567317 (1986-01-01), Ehrlich et al.
patent: 4723156 (1988-02-01), Okuaki
patent: 4909856 (1990-03-01), Ralph
patent: 5153379 (1992-10-01), Guzuk et al.
patent: 5166772 (1992-11-01), Soldner et al.

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