Shield assembly for semiconductor wafer supports

Metal working – Barrier layer or semiconductor device making

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Details

2041921, 118730, 118 45, 216 62, C23C 1448, C23C 1450

Patent

active

054765200

ABSTRACT:
A method for preventing cross-contamination of semiconductor wafers during processing comprising covering a surface portion of a support assembly with a process compatible material, engaging a semiconductor wafer with the support assembly, processing the wafer while it is engaged with the support member, and removing the process compatible material from the support assembly after said material is considered to be contaminated. A shield particularly adapted for this process includes a shield portion made from a process compatible material and a process-compatible adhesive for attaching the shield portion to the support assembly.

REFERENCES:
patent: 3889632 (1975-07-01), Brunner et al.
patent: 4397724 (1983-08-01), Moran
patent: 4718975 (1988-01-01), Bowling et al.
patent: 4733091 (1988-03-01), Robinson et al.
IBM Technical Disclosure Bulletin, vol. 27, No. 10A Mar., 1935.

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