Sheet-like board member and method of manufacturing a...

Electricity: conductors and insulators – Conduits – cables or conductors – Preformed panel circuit arrangement

Reexamination Certificate

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Details

C174S255000, C174S260000, C029S831000, C029S832000

Reexamination Certificate

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09678142

ABSTRACT:
In the present invention there is formed a sheet-like board member50having conductive coating films, such as first pads55and die pads59, formed thereon or a sheet-like board member50which has been half-etched by using conductive coating films such as first pads55and die pads59. A hybrid IC can be manufactured by means of utilization of post-processing processes of a semiconductor manufacturer. Further, a hybrid IC can be manufactured without adoption of a support board, and hence there can be manufactured a hybrid IC which is of lower profile and has superior heat dissipation characteristics.

REFERENCES:
patent: 4447857 (1984-05-01), Marks et al.
patent: 5493075 (1996-02-01), Chong et al.
patent: 5796590 (1998-08-01), Klein
patent: 6042682 (2000-03-01), Funaya et al.
patent: 6329605 (2001-12-01), Beroz et al.
patent: 6377464 (2002-04-01), Hashemi et al.
patent: 08-204103 (1996-08-01), None
patent: 11-126952 (1999-05-01), None
VSLI (Chinese text).

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