Adhesive bonding and miscellaneous chemical manufacture – Differential fluid etching apparatus – With workpiece support
Reexamination Certificate
2007-06-19
2007-06-19
Moore, Karla (Department: 1763)
Adhesive bonding and miscellaneous chemical manufacture
Differential fluid etching apparatus
With workpiece support
C118S728000
Reexamination Certificate
active
10250907
ABSTRACT:
A processing unit of the invention is a single wafer processing unit including: a processing container that can be vacuumed; a stage arranged in the processing container, on which an object to be processed can be placed; a discharging pipe connected to a bottom part of the processing container and extending substantially downward linearly; a vacuum pump directly connected to the discharging pipe; and a stage-supporting pillar arranged to extend in a substantially central portion of the discharging pipe and in a direction of the discharging pipe, the stage-supporting pillar supporting the stage.
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International Preliminary Examination Report (PCT/IPEA/409) (translated) issued for PCT/JP02/00041.
Notification of Transmittal of Copies of Translation of the International Preliminary Examination Report (Form PCT/IB/338) issued for PCT/JP02/00041.
Moore Karla
Smith , Gambrell & Russell, LLP
Tokyo Electron Limited
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