Shared on-chip decoupling capacitor and heat-sink devices

Details Shared on-chip decoupling capacitor and heat-sink devices Shared on-chip decoupling capacitor and heat-sink devices

2005-11-22

2005-11-22

Deberadinis, Robert L. (Department: 2836)

Electrical transmission or interconnection systems

Switching systems

Condition responsive

C307S112000, C307S116000

Reexamination Certificate

active

06967416

ABSTRACT:
A method and structure for an integrated chip structure comprises a substrate having a power supply, a chip attached to the substrate, at least two decoupling capacitors attached to the chip and to the power supply, and a control circuit adapted to select physical locations of active decoupling capacitors to be interspersed with inactive decoupling capacitors. The invention selectively connects and disconnects the decoupling capacitors to and from the power supply, such that the inactive decoupling capacitors provide a uniform heat dissipation function across the chip and the active decoupling capacitors provide a uniform power regulation function across the chip.

REFERENCES:
patent: 5103283 (1992-04-01), Hite
patent: 5568423 (1996-10-01), Jou et al.
patent: 5694297 (1997-12-01), Smith et al.
patent: 6115270 (2000-09-01), Yamane et al.
patent: 6424058 (2002-07-01), Frech et al.
patent: 2001/0050408 (2001-12-01), Bernstein et al.

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