Serial intelligent electro-chemical-mechanical wafer processor

Details Serial intelligent electro-chemical-mechanical wafer processor Serial intelligent electro-chemical-mechanical wafer processor

1999-08-24

2001-05-22

Hail, III, Joseph J. (Department: 3723)

Abrading

Precision device or process - or with condition responsive...

With indicating

C451S005000, C451S041000, C451S285000, C451S287000, C451S288000, C451S289000

Reexamination Certificate

active

06234870

ABSTRACT:

FIELD OF THE INVENTION
The invention relates to a device and method for removing material from a substrate. In particular, the invention relates to a method and apparatus for carrying out electrochemical and chemical mechanical polishing.
BACKGROUND OF THE INVENTION
In a variety of applications, particularly semiconductor device manufacture process, material needs to be removed from a substrate or other workpiece. First, material may be deposited on a substrate or workpiece. Portions of the material may then be removed. Sometimes, the material may be removed as part of the normal process. Other times, material may be removed because it is undesirably deposited in certain locations.
Along these lines, in damascene chip wiring methods, typically material is deposited over all surfaces on a substrate. A portion of the material is then removed by polishing to leave material in desired locations. Among the various processes involved in damascene chip wiring methods, apart from the photolithography step, the chemical mechanical polishing step is typically the next most expensive step.
Typical chemical mechanical polishing apparatuses have a low throughput. This contributes to the comparatively higher cost of chemical mechanical polishing.
SUMMARY OF THE INVENTION
The present invention provides an apparatus for removing material from a substrate. The apparatus includes a plurality of polishing cells. The polishing cells include a first polishing cell for detecting the material in a substrate and performing a first polishing operation for removing material from the substrate. The first polishing cell includes at least one sensor for characterizing the material in a substrate and at least one polishing tool for removing material from the substrate. A second polishing cell includes at least one polishing tool for completing the polishing process.
The present invention also provides a method of removing material from a substrate. The method includes arranging the substrate on an apparatus including a plurality of polishing cells. The polishing cells include a first polishing cell for detecting the material in a substrate and performing a first polishing operation for removing material from the substrate. The first polishing cell includes at least one sensor for characterizing the material in a substrate and at least one polishing tool for removing material from the substrate. A second polishing cell includes at least one polishing tool for completing the polishing process. The method also includes detecting the material on a substrate, performing a first polishing operation, and completing the polishing operation.
Furthermore, the present invention provides an apparatus for removing material from a substrate. The apparatus includes at least one polishing station comprising a plurality of elements for varying polishing process parameters.
Still other objects and advantages of the present invention will become readily apparent by those skilled in the art from the following detailed description, wherein it is shown and described only the preferred embodiments of the invention, simply by way of illustration of the best mode contemplated of carrying out the invention. As will be realized, the invention is capable of other and different embodiments, and its several details are capable of modifications in various obvious respects, without departing from the invention. Accordingly, the drawings and description are to be regarded as illustrative in nature and not as restrictive.


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