Radiation imagery chemistry: process – composition – or product th – Imaging affecting physical property of radiation sensitive... – Making electrical device
Patent
1992-04-06
1995-02-07
McCamish, Marion E.
Radiation imagery chemistry: process, composition, or product th
Imaging affecting physical property of radiation sensitive...
Making electrical device
430314, 430319, 430324, G03C 500
Patent
active
053874951
ABSTRACT:
A method of forming a multilayer circuit board is disclosed which includes a build-up process in which, beginning with a solidified layer of the dielectric disposed upon a substrate, alternate layers of conducting metal and dielectric are sequentially deposited. Each layer of conducting metal lines is defined using photoresist and a photolithographic technique. After the lines are deposited, the photoresist is removed and a second layer of photoresist defines the conductive posts which function as through holes between metal layers. After each layer of conductive line and posts is formed, and the photoresist is removed, the dielectric is flowed into place and solidified to insulate adjacent metal lines and posts. The process may be repeated as many times as necessary to build up layers of conducting metal and dielectric, and form the completed multilayer wiring board.
REFERENCES:
patent: 3466206 (1969-09-01), Beck
patent: 3791858 (1974-02-01), McPherson et al.
patent: 4680220 (1987-07-01), Johnson
Draper, Printed Circuits and Electronics Assemblies, Robert Draper Ltd, Great Britian, 1969, pp.92-108.
Seraphim et al. "Principles of Electronic Packaging" McGraw-Hill Book Co., New York, 1989, pp. 348-356.
Ahmad Arshad
Castro Myrna E.
Lee Chune
Lee James C. K.
Tung Francisca
Digital Equipment Corporation
Duda Kathleen
McCamish Marion E.
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