Separation type unit pixel having 3D structure for image sensor

Active solid-state devices (e.g. – transistors – solid-state diode – Field effect device – Having insulated electrode

Reexamination Certificate

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C257S444000

Reexamination Certificate

active

07956394

ABSTRACT:
A separation type unit pixel having a 3D structure for an image sensor, composed of a plurality of transistors, includes: a first wafer which includes a photodiode, a transfer transistor, a node of a floating diffusion area functioning as static electricity for converting electric charge into a voltage, and a pad connecting the floating diffusion area and the transfer transistor to an external circuit, respectively; a second wafer which includes the rest of the circuit elements constituting a pixel (i.e., a reset transistor, a source-follower transistor, and a blocking switch transistor), a read-out circuit, a vertical/horizontal decoder, a correlated double sampling (CDS) circuit which involves in a sensor operation and an image quality, an analog circuit, an analog-digital converter (ADC), a digital circuit, and a pad connecting each pixel; and a connecting means which connects the pad of the first wafer and the pad of the second wafer.

REFERENCES:
patent: 6307243 (2001-10-01), Rhodes
patent: 6486522 (2002-11-01), Bishay et al.
patent: 6642081 (2003-11-01), Patti
patent: 2004/0005729 (2004-01-01), Abe et al.
patent: 2009/0065824 (2009-03-01), Hwang
patent: 2010/0117178 (2010-05-01), Kim
patent: 2001-267547 (2001-09-01), None
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patent: 2004-304012 (2004-10-01), None
patent: 2004-304198 (2004-10-01), None
patent: 2006-191081 (2007-07-01), None
patent: 03/041174 (2003-05-01), None
International Search Report for corresponding International Application N. PCT/KR2006/001144 dated Jul. 24, 2006.

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