Sensors for a linear polisher

Abrading – Precision device or process - or with condition responsive... – By optical sensor

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Details

451276, 451303, B24B 4900, B24B 5100

Patent

active

057625360

ABSTRACT:
A technique for utilizing sensors to monitor the polishing of a semiconductor wafer when a linear polisher is utilized to polish the wafer. The sensors are distributed along the surface or are coupled to openings along the surface to monitor the on-going polishing process. The sensed information from the sensors are processed in order to provide feedback for compensating the fluid dispensing when fluid platens are used and/or the downforce exerted by the wafer carrier.

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