Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Having light transmissive window
Reexamination Certificate
2007-11-02
2010-12-28
Geyer, Scott B (Department: 2812)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Having light transmissive window
C438S110000, C438S113000, C438S127000, C438S460000
Reexamination Certificate
active
07858446
ABSTRACT:
A sensor-type semiconductor package and a fabrication method thereof are provided. The fabrication method of the sensor-type semiconductor package includes steps of: providing a wafer having sensor chips; attaching light-permeable bodies to the sensor chips, wherein each light-permeable body has a covering layer and an adhesive layer; singulating the wafer so as to obtain a plurality of separated sensor chips with the light-permeable bodies attached thereon; attaching and electrically connecting the separated sensor chips to a substrate module having substrates, forming an encapsulant encapsulating the sensor chips and the light-permeable bodies; cutting the encapsulant along edges of the light-permeable bodies to a depth at least corresponding the bottom edges of the covering layers; removing the covering layers with the encapsulant mounted thereon to expose the light-permeable bodies; and cutting between the substrates to obtain a plurality of sensor-type semiconductor packages.
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Chan Chang-Yueh
Chang Cheng-Yi
Chang Tse-Wen
Huang Chien-Ping
Corless Peter F.
Edwards Angell Palmer & & Dodge LLP
Geyer Scott B
Jensen Steven M.
Siliconware Precision Industries Co. Ltd.
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