Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Housing or package filled with solid or liquid electrically...
Reexamination Certificate
2006-11-16
2010-06-15
Le, Dung A (Department: 2818)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
Housing or package filled with solid or liquid electrically...
C257S678000, C257S693000, C257S731000, C257S787000, C257SE21504
Reexamination Certificate
active
07737544
ABSTRACT:
A sensor system having a substrate and a housing and a method for manufacturing a sensor system are provided, the housing essentially completely enclosing the substrate in a first substrate region, the housing in a second substrate region being provided at least partially open via an opening, the second substrate region in the region of the opening being provided so as to project from the housing, the housing being manufactured using an injection molding compound and being molded in such a way that the injection molding compound has only one flow front.
REFERENCES:
patent: 5370518 (1994-12-01), Sasaki et al.
patent: 5786626 (1998-07-01), Brady et al.
patent: 6657298 (2003-12-01), Glenn
patent: 199 29 026 (2000-12-01), None
Boes Thomas-Achim
Haag Frieder
Mueller Stefan
Kenyon & Kenyon LLP
Le Dung A
Robert & Bosch GmbH
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