Sensor package

Details Sensor package Sensor package

2007-12-27

2009-12-29

Wilson, Allan R. (Department: 2815)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With window means

C257SE23009, C257SE23192

Reexamination Certificate

active

07638865

ABSTRACT:
A sensor package includes an image sensing chip having a front surface, a plurality of bumps, a glass cover plate, and a connector. The plurality of bumps are formed on the front surface, and are electrically connected to the image sensing chip. The glass cover plate has a bottom surface facing the front surface, and the glass cover plate has a plurality of transparent conductive wires formed on the bottom surface. A terminal of each of the transparent conductive wires is electrically connected to a respective bump, and another terminal of each of the transparent conductive wires extends out of an orthogonal projection area of the image sensing chip on the bottom surface. The connector is electrically connected to the another terminal of each of the transparent conductive wires.

REFERENCES:
patent: 6791076 (2004-09-01), Webster
patent: 7215015 (2007-05-01), Moden
patent: 7511367 (2009-03-01), Minamio
patent: 2003/0209772 (2003-11-01), Prabhu
patent: 2004/0056180 (2004-03-01), Yu
patent: 2006/0152142 (2006-07-01), Nishitani et al.
patent: 2008/0066802 (2008-03-01), Reddy
patent: 2009/0121302 (2009-05-01), Lin et al.

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