Sensing device and method of leveling a semiconductor wafer

Details Sensing device and method of leveling a semiconductor wafer Sensing device and method of leveling a semiconductor wafer

1997-07-08

1999-08-31

Rose, Robert A.

Abrading

Precision device or process - or with condition responsive...

With indicating

451 5, 451 10, 451 41, 451 26, 451288, B24B 0000

Patent

active

059445807

ABSTRACT:
An improved sensing device and method for leveling a semiconductor wafer in a chemical mechanical polishing apparatus, which easily detects the change of pressure from a semiconductor wafer contacting with the polishing surface. The present invention includes a polishing platen having a polishing pad on the upper leveled surface thereof, and fixed to a rotatable platen driving shaft. A carrier is rotatably provided on the upper surface of the polishing platen and holding the semiconductor wafer such that the lower surface of the semiconductor wafer is uniformly contacted with the polishing pad. A pressure detecting sensor senses the pressure applied from the semiconductor wafer on the polishing pad and outputs a corresponding signal.

REFERENCES:
patent: 5567199 (1996-10-01), Huber et al.
patent: 5720845 (1998-02-01), Liu
patent: 5733176 (1998-03-01), Robinson et al.

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