Seminconductor package

Details Seminconductor package Seminconductor package

1997-02-21

1998-06-30

Thomas, Tom

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With contact or lead

257698, 257774, 257778, H01L 2348, H01L 2352

Patent

active

057738823

ABSTRACT:
The first semiconductor package comprises a board equipped wiped with a wiring circuit including a connection on a main surface, a semiconductor chip mounted face down having input/output terminal corresponding to the connection of the board, flat external connector terminals leading to and are exposed on the other main surface of the board, and filled via hole connection to be electrically connected to the wiring circuit through a filled via hole installed right above each external connector terminal. Further, the second semiconductor package utilizes the above-described construction but the flat external connector terminals are led to and exposed on the other main surface of the board in a constant-pitch lattice-array.

REFERENCES:
patent: 4694138 (1987-09-01), Oodaira et al.
patent: 4710798 (1987-12-01), Marcantohio
patent: 5258648 (1993-11-01), Lin
patent: 5370759 (1994-12-01), Hakotami et al.
patent: 5399898 (1995-03-01), Rostoker
patent: 5399903 (1995-03-01), Rostoker et al.
patent: 5461197 (1995-10-01), Hiruta et al.
European Search Report, dated Aug. 29, 1995 (including Abstract No. 95302884.2 and Annex).

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