Semiconductor wafer with circuits bonded to a substrate

Details Semiconductor wafer with circuits bonded to a substrate Semiconductor wafer with circuits bonded to a substrate

1990-12-10

1993-03-30

James, Andrew J.

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Of specified configuration

257747, 257774, 257779, 257757, 257766, H01L 2348, H01L 2944, H01L 2954, H01L 2960

Patent

active

051986957

ABSTRACT:
A bonded structure is described consisting of a semiconductor wafer, preferably gallium arsenide, soldered to a substrate material. A method for forming the structure is also described. The structure provides mechanical support and thermal conductivity for the wafer, as well as a multitude of connections through the substrate material at predetermined locations on the wafer. The substrate material and the soldering process are selected to minimize the resulting stresses in the wafer. A pattern of pads consisting of a refractory metal covered by a solder material is formed on the substrate to maintain space for excess solder in order to avoid the shorting of the individual connections on the wafer, and to control the size and location of voids in the solder upon solidification.

REFERENCES:
patent: 3458925 (1969-08-01), Napier et al.
patent: 3585713 (1971-06-01), Kaneda et al.
patent: 3604989 (1971-09-01), Haneta et al.
patent: 3648131 (1972-03-01), Stuby
patent: 3761782 (1973-09-01), Youmans
patent: 3787252 (1974-01-01), Filippazzi et al.
patent: 3986251 (1976-10-01), Altemus et al.
patent: 4023725 (1977-05-01), Ivett et al.
patent: 4823136 (1989-04-01), Nathanson et al.
patent: 5027189 (1991-06-01), Shannon et al.

Affiliated with

Also associated with

Rating

Semiconductor wafer with circuits bonded to a substrate does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Semiconductor wafer with circuits bonded to a substrate, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Semiconductor wafer with circuits bonded to a substrate will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1283149