Semiconductor wafer with alignment marks

Details Semiconductor wafer with alignment marks Semiconductor wafer with alignment marks

1994-06-21

1996-07-02

Crane, Sara W.

Active solid-state devices (e.g., transistors, solid-state diode

Alignment marks

257798, H01L 23544, H01L 2358

Patent

active

055325203

ABSTRACT:
Disclosed is an alignment mark for the X directional alignment of a chip area on a semiconductor wafer, for example. The alignment mark comprises recesses and projections formed on a semiconductor substrate. The recesses or projections are repeatedly arranged in the X direction. The X directional width of the recesses or projections is set smaller than the X directional width of a grain on a metal film formed on the recesses and projections or the average particle size, as viewed from above the semiconductor substrate. The projections may be formed by a insulating layer formed on the semiconductor substrate.

REFERENCES:
patent: 5325414 (1994-06-01), Tanaka et al.

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