Semiconductor device manufacturing: process – Including control responsive to sensed condition – Optical characteristic sensed
Reexamination Certificate
2008-01-01
2008-01-01
Smith, Bradley K (Department: 2891)
Semiconductor device manufacturing: process
Including control responsive to sensed condition
Optical characteristic sensed
C438S005000, C438S007000, C257SE21530
Reexamination Certificate
active
07314766
ABSTRACT:
A treatment method of a semiconductor wafer includes treating the semiconductor wafer in a first solution having at least one kind of an oxidative acid and an oxidizing agent and treating the semiconductor wafer in a second solution having at least one of HF and NH4F.
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Sugamoto Junji
Tanzawa Katsujiro
Tsuchiya Norihiko
Ushiku Yukihiro
Finnegan Henderson Farabow Garrett & Dunner L.L.P.
Kabushiki Kaisha Toshiba
Smith Bradley K
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