Semiconductor wafer transfer method and arm mechanism

Details Semiconductor wafer transfer method and arm mechanism Semiconductor wafer transfer method and arm mechanism

1987-11-03

1989-03-28

Powell, William A.

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

156345, 294 28, 414222, B44C 122

Patent

active

048161160

ABSTRACT:
A complete integrated circuit processing module, wherein multiple processing stations, each with its own vacuum isolation, are located inside a single module which is held at hard vacuum. A wafer transport arm mechanism permits interchange of wafers among the processing stations and a load lock. The load lock is equipped to remove and replace wafers from a vacuum-sealed wafer carrier. The wafers remain face-down and under hard vacuum during all the wafers handling steps.

REFERENCES:
patent: 4550242 (1985-10-01), Uehara et al.
patent: 4584045 (1986-04-01), Richards
patent: 4586743 (1986-05-01), Edward et al.
patent: 4639028 (1987-01-01), Olson
patent: 4659413 (1987-04-01), Davis et al.

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