Semiconductor wafer transfer method and apparatus

Details Semiconductor wafer transfer method and apparatus Semiconductor wafer transfer method and apparatus

1997-08-29

1999-06-29

Bucci, David A.

Material or article handling

Movable rack having superposed, charge-supporting elements,...

Rack moved vertically by elevating means

414416, 414752, 414763, 414773, 414811, 414936, 414937, 414941, B65G 106

Patent

active

059159103

ABSTRACT:
A wafer transfer mechanism and method involves inserting a wafer carrying arm into position within a wafer cassette so that a wafer may be detachably coupled to the arm. The arm is moved linearly to position the arm for coupling to the wafer, with the motion being reversed to remove the wafer from the cassette. After the arm clears the cassette, the arm may be pivoted about an axis which is transverse to the longitudinal axis of the arm to invert the wafer and deposit it at a destination location, such as onto a conveyor. A vacuum may be used to detachably couple the wafer to the arm with the vacuum being relieved to release the wafer at the destination location. A puff or pulse of air may be used to assist in decoupling the wafer from the arm.

REFERENCES:
patent: 3314554 (1967-04-01), Cuniberti
patent: 4056198 (1977-11-01), Boserup
patent: 4449885 (1984-05-01), Hertel et al..
patent: 4529353 (1985-07-01), Dean et al.
patent: 4586743 (1986-05-01), Edwards et al.
patent: 4744715 (1988-05-01), Kawabata et al.
patent: 4770590 (1988-09-01), Hugues et al.
patent: 4773687 (1988-09-01), Bush et al.
patent: 4775281 (1988-10-01), Prentakis
patent: 4778331 (1988-10-01), Kimata et al.
patent: 4778332 (1988-10-01), Byers et al.
patent: 4816116 (1989-03-01), Davis et al.
patent: 4900212 (1990-02-01), Mikahara
patent: 5004399 (1991-04-01), Sullivan et al.
patent: 5011366 (1991-04-01), Miller
patent: 5188501 (1993-02-01), Tomita et al.
patent: 5193969 (1993-03-01), Rush et al.
patent: 5193972 (1993-03-01), Engelbrecht
patent: 5207548 (1993-05-01), Suffel et al.
patent: 5261776 (1993-11-01), Burck et al.
patent: 5275521 (1994-01-01), Wada et al.
patent: 5299901 (1994-04-01), Takayama et al.
patent: 5382128 (1995-01-01), Takahashi et al.
patent: 5738482 (1998-04-01), Piazza
patent: 5772386 (1998-06-01), Mages et al.

Affiliated with

Also associated with

Rating

Semiconductor wafer transfer method and apparatus does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Semiconductor wafer transfer method and apparatus, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Semiconductor wafer transfer method and apparatus will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1369991