Semiconductor wafer testing method with probe pin contact

Details Semiconductor wafer testing method with probe pin contact Semiconductor wafer testing method with probe pin contact

1998-02-25

2000-05-16

Graybill, David E.

Semiconductor device manufacturing: process

With measuring or testing

Packaging or treatment of packaged semiconductor

438 18, 438977, G01R 3126, H01L 2166

Patent

active

060636408

ABSTRACT:
A semiconductor wafer testing method includes a pre-test step for forming a temporary test film on a surface of a semiconductor wafer, a test step for testing the semiconductor wafer by applying a probe to the temporary test film and a post-test step for exfoliating the temporary test film from the surface of the semiconductor wafer. The temporary test film includes test electrode groups each provided with a plurality of regularly arranged test electrodes, and wiring patterns for electrically connecting the test electrodes with corresponding ones of semiconductor unit electrodes in respective semiconductor units on the semiconductor wafer. Probe pins of said probe are arranged so as to be aligned with corresponding ones of the test electrodes of the respective test electrode groups.

REFERENCES:
patent: 5716218 (1998-02-01), Farnworth et al.
patent: 5851845 (1998-12-01), Wood et al.

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